Nox TG-1 4g Thermal Paste

About the Nox TG-1 Thermal Paste 4g

Nox TG-1, the high-conductivity thermal paste for your hardware

The Nox TG-1 Thermal Paste 4g is the right choice for those seeking maximum performance in computer cooling. Designed to ensure efficient heat transfer between the CPU, GPU, and heatsinks, it guarantees lower temperatures and stability even under intense loads.

Superior thermal performance with safety

With a thermal conductivity of 2.5 W/m-K and low thermal resistance, the TG-1 ensures rapid and effective heat dissipation. Its formula is completely free of electrical conductivity, eliminating the risk of short circuits, making it safe even in high-performance systems.

Simple and long-lasting application

Designed to withstand extreme conditions, it operates within a wide temperature range of -30 to 240 ºC. The 4-gram package includes an application spatula that facilitates the even distribution of the compound, ensuring full contact between surfaces.

High-density formula and easy maintenance

With a density of 3.69 g/cm³ and a viscosity of 850 poise, the TG-1 remains stable and efficiently fills the microspaces between the processor and the heatsink. Its texture allows for precise application and simple cleaning, ensuring consistent thermal performance over time.